The Irish Research Council (IRC) has announced the awardees for the postdoctoral fellowship, postgraduate scholarship, and Enterprise Partnership Awards, with four Tyndall researchers receiving funding across the three schemes.
Higher education minister Simon Harris recently announced that €24.6m in Irish Research Council funding will be granted to support emerging researchers and projects. He said: “I am pleased to announce funding for critical research projects spanning a broad range of areas across science, technology, engineering, maths, arts, humanities and social sciences.
“By supporting this activity, we are cultivating generational talent within Ireland’s research and innovation ecosystem that is focusing on key challenges and opportunities and on the issues facing this generation such as climate and technology.”
The Tyndall Awardees are:
Postdoctoral Fellowship Programme
Karl Rönnby
Project Title: 'Control of interconnect metal morphology on complex substrates for 3D neuromorphic architectures'.
Anurag Pritam
Project Title: 'Room temperature multiferroicity in higher-layered homologues of Aurivillius films for sustainable data storage applications'.
Postgraduate Scholarship Programme
Michael Sweetman
Project Title: 'Control of the Morphology of Metal Films Deposited on 2D Materials Substrates'.
Enterprise Partnership Scheme (Postgraduate)
Hazel Neill
Project Title: 'All 2D Material-Based Josephson Junction for Quantum Technologies (2D-QT)'.
Dr Michael Nolan, chair of the Research Committee at Tyndall National Institute said: “Postgraduate students and early career researchers, who show high potential as future research leaders, are critical to developing our research excellence at Tyndall as well as providing a pipeline of the highest quality research talent.
"These awards, spanning PhD, enterprise focused PhD and postdoctoral researchers, are highly competitive and highlight the breadth and quality of research and the research environment at Tyndall, allowing the successful awardees to tackle critical questions in materials, data storage and semiconductor technologies.”